Decapsulation & X-RAY Inspection

Decapsulation and Die Analysis:

1. Wafer inspection inside the chip
2.Authenticity and lose efficacy analysis

X-RAY Inspection:

1. IC package defective detection
2. Printed circuit defective detection
3. SMT Detection and measurement
4. Line connection defective detection
5.Material inspection and measurement
  • Electronic Components Decapsulation & X-RAY Inspection
Shenzhen Ino Electronics Technology Co., Ltd. 
R1007, Bld2, Longguang century, No. 23, haixiu Road, 
Bao'an District,518133 Shenzhen, China
Your Reliable Partner In Sourcing and Solutions For Electronic Components, Semiconductor and Obsolescence, Inotoday!
Ino Electronics Co.,Ltd.
Shinjuku Nomura Building, 32F, 1-26-2 Nishi-Shinjuku, 
Shinjuku-ku, Tokyo, Japan

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R1318-19,13/F Hollywood Plaza, 610 Nathan Road, Mongkok, 
Kowloon, Hong Kong
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